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Filtering by: Subject Buckling (Mechanics) Remove constraint Subject: Buckling (Mechanics) Peer Reviewed No Remove constraint Peer Reviewed: No Subject Diffusion bonding (Metals) Remove constraint Subject: Diffusion bonding (Metals)

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  • Cooling rate limitations in the diffusion bonding of large microchannel arrays

    Creator:
    Lingam, Gopi K.
    Abstract:
    A significant barrier to the diffusion bonding of large (i.e. 600 mm) microchannel devices is the large capital investment required to setup production. This large capital investment extends from long heating and cooling cycles leading to poor production capacities. Empirical studies in industry have shown that cooling rate is limited...
    Resource Type:
    Masters Thesis
    Full Text:
    is believed to be caused by thermal buckling. In this thesis, the limits of cooling rates during