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  • Enabling metal-fill-aware design of integrated circuits

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
    Resource Type:
    Dissertation
    Full Text:
    presented on January 3, 2014. Title: Enabling Metal-Fill-Aware Design of Integrated Circuits Abstract