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  • Modelling of on-chip spiral inductors for silicon RFICs

    Creator:
    Melendy, Daniel
    Abstract:
    In high-frequency circuit design, performance is often limited by the quality of the passive components available for a particular process. Specifically, spiral inductors can be a major bottle-neck for Voltage-Controlled Oscillators (VCOs), Low-Noise Amplifiers (LNAs), mixers, etc. For designers to correctly optimize a circuit using a spiral inductor, several frequency-domain...
    Resource Type:
    Masters Thesis
    Full Text:
    AN ABSTRACT OF THE THESIS OF Daniel Melendy for the degree of

  • CAM : a new Circuit Augmentation Method for modeling interconnects and passive components

    Creator:
    Kolstad, Joel W.
    Abstract:
    Contemporary circuit design involves significant computer-based simulation, calling for a balance between circuit model accuracy and simulation run time. Traditionally, circuit modelers concentrated on producing either (1) physically-based models, where each element in the model correlates to a physically meaningful aspect of the device being modeled or (2) mathematically-based "macromodels,"...
    Resource Type:
    Masters Thesis
    Full Text:
    Daniel Melendy and Adam Watson. Eric Vernon has also contributed to CAM’s code base. Most of the data

  • OSU theses and dissertations : 1966-1970

    Creator:
    Guss, Margaret Basilia
    Abstract:
    A departmental and author index of Masters' Theses and Doctoral Dissertations accepted by the Graduate School.
    Resource Type:
    Book
    Full Text:
    , Daniel Wood. An Interindustry Analysis of the Importance of Grazing on Federal Lands to the Economy of

  • Analysis and modeling of microstrip on-chip interconnects on silicon substrate

    Creator:
    Lan, Hai
    Abstract:
    The electrical performance of on-chip interconnects has become a limiting factor to the performance of modern integrated circuits including RFICs, mixed-signal circuits, as well as high-speed VLSI circuits due to increasing operating frequencies, chip areas, and integration densities. It is advantageous to have fast and accurate closed-form expressions for the...
    Resource Type:
    Masters Thesis
    Full Text:
    , Chi-Young Lim, Daniel Melendy, Richard Lutz, Sorwar Hossain, and Amy Luoh, for their encouragement

  • Analysis and modeling of coplanar on-chip interconnects on silicon substrates

    Creator:
    Luoh, Yi
    Abstract:
    The electrical behavior of on-chip interconnects has become a dominant factor in silicon-based high speed, RF, and mixed-signal integrated circuits. In particular, the frequency-dependent loss mechanisms in heavily-doped silicon substrates can have a large influence on the transmission characteristics of on-chip interconnects. To optimize the performance of the integrated circuit,...
    Resource Type:
    Masters Thesis
    Full Text:
    suggestions. I would also like to thank my friends and colleagues, Ji Zheng, Hai Lan, Chi-Young Lim, Daniel

  • Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

    Creator:
    Zheng, Lei
    Abstract:
    For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to...
    Resource Type:
    Dissertation

  • Equivalent circuit modeling of on-chip magnetic devices based on terminal measurements

    Creator:
    Gaskill, Steven G.
    Abstract:
    The addition of thin-film alloy magnetic materials to integrated circuit processing enables a number of novel monolithic circuits. Examples include fully integrated magnetic field sensors, signal and power galvanic isolation circuits, and power supplies on chip (PwrSoC). There are several benefits to integrating these traditionally off-chip devices, including improved manufacturability,...
    Resource Type:
    Dissertation

  • Enabling metal-fill-aware design of integrated circuits

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
    Resource Type:
    Dissertation