A variational integral method in the Fourier transform domain is
used to calculate the characteristic normal mode parameters of a coupled
pair of nonsymmetrical microstrip transmission lines in an inhomogenous
dielectric medium under quasi-TEM conditions. These together with the
theory of such structures are used to show that ideal directional...
Accurate and efficient computational methods to evaluate the
quasi-TEM parameters of various planar structures such as microstrips,
coplanar lines and coplanar waveguides are developed. The characteristic
parameters of all these structures which are used extensively
in microwave integrated circuits for applications as transmission
lines and other circuit elements are computed...
The properties of linear active coupled lines consisting of
electrically long GaAs MESFET structures are investigated for possible
applications as traveling-wave broad-band amplifiers. In addition,
the nonlinear coupled Schottky lines are studied for applications as
voltage tunable circuit elements.
The analysis of the general active asymmetric coupled transmission
lines in...
An analog signal processing technique allowing arbitrary step
response is presented. A transversal structure is used with
nonuniform contradirectional coupling to provide continuous tapping.
Sinusoidal and chirp responses are presented as examples implemented
using this nonuniformly coupled microstrip structure.
The purpose of the thesis is to synthesize the major results of a continuous
research effort directed toward new applications of high speed sampling in general and Electrooptic Sampling in particular.
Equivalent time sampling of repetitive high speed signals continues to provide significant performance enhancements for present and future generations...
A numerical technique to compute the time domain response of multiconductor lossy
uniform and nonuniform lines terminated in general nonlinear elements is presented. The
technique is based on the generalized method of characteristics. The method transforms the
original system of transmission line equations into a system of ordinary differential
equations....
Static and dynamic numerical techniques which are suited for the
analysis and simulation of various planar microstrip components
encountered in hybrid and monolithic microwave integrated circuits are
presented. The static analysis makes use of an excess source formulation in conjunction with an efficient mathematical treatment to
extract the discontinuity parameter...
Coplanar microstrip structures placed on dielectric substrates
are used as high frequency electro-optic modulators. The method of
lines, a mathematical technique for solving partial differential
equations, has been applied to solve for the propagation
characteristics of such a configuration.
It has been determined that simple transmission line models
are adequate...
The propagation characteristics of a new coupled fin line structure, with
asymetrical, rectangular, top and bottom housings, is evaluated by using the modal
analysis technique. The boundary Green's function of the structure, relating the surface
currents to the electric fields is derived by using this technique. The propagation
characteristics, i.e....
In this thesis a numerical technique to model general microstrip asymmetric and multiple step discontinuities is presented. The method is based on a magnetic wall waveguide model that is assumed to be valid for describing the electromagnetic fields associated with the microstrip line and in the vicinity of microstrip discontinuities....
The purpose of this study is to develop experimental techniques to
characterize typical interconnect discontinuities, including bends, steps, T
junctions, vias and pads, which are the most commonly encountered
interconnections in high speed digital integrated circuits, hybrid and
monolithic microwave circuits and electronic packages. The time domain
reflection response of...
Accurate, efficient and general computational
techniques are developed to evaluate the scattering
parameters of passive microstrip components composed of
discontinuities in microstrip transmission lines on
general two layer substrates with single and two level
metallization. An open domain model is used. The
Electric Field Integral Equation is examined and the...
Layered multiconductor coupled slot and strip-slot structures are characterized by introducing the full-wave modal analysis as well as the quasi-TEM spectral domain technique. In the modal analysis, the electric and magnetic fields are constructed in terms of modal fields in different regions. Application of the boundary conditions at interfaces for...
A numerical method based on the the method of characteristics for hyperbolic systems
of partial differential equations in four independent variables is developed and used
for solving time domain Maxwell's equations. The method uses the characteristic
hypersurfaces and the characteristic conditions to derive a set of independent equations
relating the...
The improved accuracy of Time Domain Reflection and Transmission (TDR/T)
measurements made possible by the calibration process known as Time Domain
Network Analysis (TDNA) is applied to the problem of characterization and modeling
of electronic interconnect and packaging structures. TDNA uses measurements of
known and partially known calibration standards to...
The purpose of this study is to develop accuracy enhancement techniques for the Time
Domain Reflection/Transmission (TDR/T) measurements including the analysis of the
error sources for the Enhanced Accuracy TDR/T (EA-TDR/T). These TDR/T techniques
are used for IC and IC package interconnect characterization and equivalent circuit model
extraction, which are...
A new second order accurate nonuniform grid spacing technique which does not
depend on supraconvergence is developed for Finite Difference Time Domain (FDTD)
simulation of general three dimensional structures. The technique is useful for FDTD
simulations of systems which require finer details in small regions of the simulation space by...
Recent advances in high density low cost RF and microwave three dimensional
integration technologies using LTCC(Low Temperature Cofired Ceramics),
laminate and other multilayer hybrid and integrated circuits have increased interest
in the design of embedded passive components such as inductors, capacitors and
filters. The purpose of this study is to...
The advent of low-cost RFIC's fabricated in Silicon-based technologies has led to the use of monolithic lumped elements which are located on-die. While it is clearly advantageous to have a high degree of integration and thus fewer off chip elements, parasitic losses due to semiconducting substrate effects can be a...