The purpose of this study is to develop experimental techniques to
characterize typical interconnect discontinuities, including bends, steps, T
junctions, vias and pads, which are the most commonly encountered
interconnections in high speed digital integrated circuits, hybrid and
monolithic microwave circuits and electronic packages. The time domain
reflection response of...
With edge rates of high speed digital devices pushing into the sub-nano second
range, interconnections with the associated packages play a major role in determining
the speed, size and performance of digital circuits and systems. The purpose of this
study is to develop experimental techniques based on time domain peeling...
