This thesis presents a systematic top-down methodology for simulating a phase-locked loop using a macro model in Verilog-A. The macromodel has been used to evaluate the jitter due to supply noise, thermal noise, and ground bounce. The noise simulation with the behavioral model is roughly 310 times faster (best case)...
This thesis presents Silencer!, a fully automated, schematic-driven tool for substrate noise coupling simulation and analysis. It has been integrated in the CADENCE DFII environment and seamlessly enables substrate coupling analysis in a standard mixed-signal design flow. Silencer! aids IC designers in the analysis of substrate noise coupling at different...
A variable gain, high linearity, low power baseband filter for WLAN applications is implemented in a 1.5 V 3 V 0.15 μm CMOS process. This fourth-order low-pass filter, which is introduced in the transmit channel as a reconstruction filter between the D/A converter and the mixer, has a measured cut-off...
This thesis presents an automated methodology to calibrate the substrate profile for accurate prediction of substrate parasitics using Green's function based extractors. The technique requires fabrication of only a few test structures and results in an accurate three layered approximation of a heavily doped epitaxial silicon substrate. The obtained substrate...
Strategies for simulation and measurement of substrate noise have been analyzed using various digital and analog circuits fabricated in the TSMC 0.35um heavily doped CMOS process. The measurements validate a substrate noise coupling macromodel that has been used to obtain the simulation results. The simulations and measurements also substantiate the...
This thesis examines substrate noise coupling for NMOS transistors in heavily doped substrates. The study begins with the analysis of an NMOS transistor switching noise in a digital inverter at the device level. A resistive substrate network for the NMOS transistor is proposed and verified. Coupling between N+- P+ contacts...
An analysis of substrate noise coupling in mixed-signal circuits has been performed in the TSMC 0.25 [mu]m lightly doped and heavily doped CMOS processes. Methods to minimize noise coupling in both the chip design and board design phases are presented along with techniques for accurate circuit simulation of noise coupling....
In April of 1997 it was pointed out at an NSF Engineering Education Innovators conference that “… education appears to ignore the need for connections and for integration – which should be at the core of an engineering education.” In order to solve this problem a group named ‘TekBotsTM’ was...
A methodology for rapid estimation of substrate noise generated by digital circuitry in mixed-signal circuits is presented. This methodology is incorporated into the Silencer! framework, and also provides for future improvements including pre-layout noise estimation. Measurements of a test chip fabricated in the TSMC o.25[mu]m heavily doped logic process validate...