In recent years, the rapidly growth of CMOS technology has evolved towards submicron and deep-submicron features. Due to smaller device sizes, and significant demand for low-power designs, the maximum allowable power supply voltage is restricted. So far, two solutions; clock boosting and switched opamp schemes have been proposed. The material...
Recent advances in high density low cost RF and microwave three dimensional
integration technologies using LTCC(Low Temperature Cofired Ceramics),
laminate and other multilayer hybrid and integrated circuits have increased interest
in the design of embedded passive components such as inductors, capacitors and
filters. The purpose of this study is to...
A new circuit technique called Folded Source Coupled Logic (FSCL) has been developed
to implement the digital section of mixed-signal IC applications. This FSCL circuit technique
offers the advantage of low overlap current spikes during the switching transitions
of conventional CMOS gates. This overlap current spike has become one of...
This research was motivated by the use of multi-track feeders in the printed
circuit board (PCB) assembly. In a low volume, high mix production environment,
setup time is usually considered more important than processing time. Implementation
of multi-track feeders not only increases the capacity of the surface mount
machines but...
A new structure for the implementation of bit/serial adaptive IIR filter is
presented. The bit level system consists of gated full adders for the arithmetic
unit and data latches for the data path. This approach allows recursive
operation of the IIR filter to be implemented without any global
interconnections, minimal...
Minimizing the dynamic power consumption of a circuit is becoming a more and more important issue for digital circuit design in the age of portable electronics. Among all the arithmetic circuits, addition is the most fundamental operation. Therefore, designing low power adder is an important and necessary research area.
In...
As the drive continues to reduce the size of Printed Wiring Assemblies (PWAs),
improve performance of electronic assemblies, and reduce costs of these products,
reliable secondary (bottom) side reflow operations must be developed. Attaching Surface
Mount Technology (SMT) components to the secondary side of a Printed Circuit Board
(PCB) is...
Present day data processing technology requires very high speed signal processing
and data conversion rates. Traditionally, these circuits have been implemented in silicon
MOS technology, whose high speed performance is limited, due to inherent material properties.
Though relatively immature compared to silicon technology, GaAs integrated circuit
technology appears to be...