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File Format: pdf (Portable Document Format)File Title: A Numerical Study of the Thermal Performance for Surface Mounted and Through-Hole Mounted Integrated Circuits.Page Count: 92File Size: 5921669Original Checksum: 27cc5ccbd06a3d3eeaeaead46cc4b916Mime Type: application/pdf
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User Scholars Archive Admin has attached WangJyiRen1995.pdf to A numerical study of the thermal performance for surface mounted and through-hole mounted integrated circuits |
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